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Cleaving Direct-Laser-Written Microstructures on Demand

Cleaving Direct-Laser-Written Microstructures on Demand
Autor:

M.M. Zieger, P. Mueller, A.S. Quick, M. Wegener, and C. Barner-Kowollik 

Links:
Quelle:

Angew. Chem. Int. Ed. 56, 5625-5629 (2017)

Datum: 13.04.2017

Abstract:

Using an advanced functional photoresist we introduce direct-laser-written (DLW) 3D microstructures capable of complete degradation on demand. The networks consist exclusively of reversible bonds, formed by irradiation of a phenacyl sulfide linker, giving disulfide bonds in a radical-free step-growth polymerization via a reactive thioaldehyde. The bond formation was verified in solution by ESI-MS. To induce cleavage, dithiothreitol causes a thiol–disulfide exchange, erasing the written structure. The mild cleavage of the disulfide network is highly orthogonal to other, for example, acrylate-based DLW structures. To emphasize this aspect, DLW structures were prepared incorporating reversible structural elements into a non-reversible acrylate-based standard scaffold, confirming subsequent selective cleavage. The high lateral resolution achievable was verified by the preparation of well-defined line gratings with line separations of down to 300 nm.